1.The machine leverages the Company’s innovative design based on current market demand, designed
with the latest chip technology for a simple BGA desoldering station that integrates far-infrared lights,
a preheat station, and a soldering station.
2.This model can be used for desoldering parts with poor reception of infrared light. Meanwhile,
this machine only takes up a small amount of work surface space. This practical, energy-efficient,
powerful machine can meet all routine or professional application needs!
3.With the pioneering, industry-first user-friendly design, the infrared desoldering uses the latest security
probe for real-time tracking of desoldering IC surface temperatures to prevent heat damage to
desoldered parts for safe applications regardless of user skill.
4.The hot air gun employs Samsung microchip-PID programming for high-speed 100ms
real-time tracking of air gun outlet temperatures and soldering iron tip temperatures, with real-time
calibration! Temperatures are extremely stable.
5.Soldering iron handle wire employs a high-temperature silicone wire (undamaged when 300o soldering tip contacts silicone wire for 30 seconds); the heatingelement employs an imported high-power heating
element for fast temperature compensation, particularly suitable for desoldering crude terminals,large joints,
and difficult to reach spots, not to mention general solder joint desoldering.
6.The machine features -50℃ to +50℃ temperature compensation. The infrared light features
5-80 power adjustment.
7.Celsius/Fahrenheit Display Temperature Function: To satisfy market demand in different regions,
the Company has designed a temperature display mode.
Rated Voltage AC 220V±10% 50Hz
Total Power 1450W
300℃ Constant Temperature Power (High-Speed PID
Programmed to Energy Savings) 600W±10%
Operating Environment 0~40℃ Relative Humidity<80%
Storage Temperature -20~80℃ Relative Humidity<80%
Performance Parameter Soldering Iron
Operating Voltage AC 26V±10% 50Hz
Output Power 75W
Temperature Range 200℃~480℃
Temperature Stability ±1℃ (Static)
Display Mode Red LED Digital Display
Calibration Mode IPID Digitally Programmed Calibration
PID Temperature Calibration Cycle High-Speed 100ms
Heating Core Imported High-Powered Heating Core
Tip-to-Ground Impedance <2Ω
Tip-to-Ground Voltage <2mV
Infrared Light Preheat Station
Operating Voltage AC 220V±10% 50Hz Operating Voltage AC 220V±10% 50Hz
Max. Power 150W Output Power 600W
Effective Irradiated Area 30*30mm Heated Region Area 130X130mm
Display Mode Red/Green LED Digital Display Display Mode Red/Green LED Digital Display
Safety Temperature Sensor K-type Thermocouple Temperature Sensor K-type Thermocouple
Temperature Control Range 50℃--350℃ Temperature Control Range 50℃--200℃
1). Suitable for desoldering and soldering BGA, SOIC, CHIP, QFP, PLCC package SMD IC,
Particularly suitable for desoldering BGA module, computer motherboard north and south bridge,
all kinds of mobile phone motherboard SMT IC and LED lights.
2). Shrinking, Paint drying, adhesive removal, thawing, warming, Plastic welding etc.